Huizhou Green Mark Photoelectric Technology Co.,Ltd
Copper-Clad Laminate & Printed Circuit Board, Sheet Adhesive & Adhesive Tape manufactuer
Select Language
English
中文
Home Products

Aluminum Base Copper Clad Laminate

Browse Categories
Contact Us
Miss. Chen
No.2 Yonglian Rd,Gonglian, Longfeng,Huicheng District,Huizhou ,Guangdong, China.
I am Online Chat Now
Miss. Chen(Sales manager) Miss. Chen(Sales manager)

Aluminum Base Copper Clad Laminate

(4)

Specification: Thermal conductivity: 1.0W/m.k Copper foil: 1oz Dielectric thickness: 80 m ~150 m Thickness: 0.6mm / 0.8mm / 1.0mm / 1.2mm / 1.6mm / 2.0mm /2.5mm / 3.0mm / 4.0mm Supply size: 500*600mm... [Read More]

2015-08-18 17:15:17

Specification: Thermal conductivity: 1.5W/m.k Copper foil: 1oz Dielectric thickness: 80 m ~ 150 m Thickness: 0.6mm / 0.8mm / 1.0mm / 1.2mm / 1.6mm / 2.0mm /2.5mm / 3.0mm / 4.0mm Supply size: 500*600mm... [Read More]

2015-08-18 17:18:56

Specification: Thermal conductivity: 2.0 W/m.k Copper foil: 1oz Dielectric thickness: 80 m ~150 m Thickness: 0.6mm / 0.8mm / 1.0mm / 1.2mm / 1.6mm / 2.0mm /2.5mm / 3.0mm / 4.0mm Supply size: 500*600mm... [Read More]

2015-08-18 17:20:15

Specification: Thermal conductivity: 3.0 W/m.k Copper foil: 1oz Dielectric thickness: 80 m ~150 m Thickness: 0.6mm / 0.8mm / 1.0mm / 1.2mm / 1.6mm / 2.0mm /2.5mm / 3.0mm / 4.0mm Supply size: 500*600mm... [Read More]

2015-08-18 17:21:58

Page 1 of 1 :   |< << 1  >> >|