Huizhou Green Mark Photoelectric Technology Co.,Ltd
Copper-Clad Laminate & Printed Circuit Board, Sheet Adhesive & Adhesive Tape manufactuer
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Copper Base Copper Clad Laminate

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Copper Base Copper Clad Laminate

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Specification: Thermal conductivity: 1.0 W/m.k Dielectric thickness: 75 m ~150 m Copper CCL thickness: 0.6 mm / 1.0mm / 1.6mm /2.0mm /3.0mm Copper foil: 1oz / 2 oz /3 oz Supply size : 500×600mm/400... [Read More]

2015-08-18 17:04:27

Specification: Thermal conductivity: 1.5 W/m.k Dielectric thickness: 100 m ~350 m Copper CCL thickness: 0.6 mm / 1.0mm / 1.6mm /2.0mm /3.0mm Copper foil: 1oz / 2 oz /3 oz Supply size : 500×600mm/400... [Read More]

2015-08-18 16:39:32

Specification: Thermal conductivity: 2.0 W/m.k Dielectric thickness: 100 m ~350 m Copper CCL thickness: 0.6 mm / 1.0mm / 1.6mm /2.0mm /3.0mm Copper foil: 1oz / 2 oz /3 oz Supply size : 500×600mm/400... [Read More]

2015-08-18 16:54:35

Specification: Thermal conductivity: 3.0 W/m.k Dielectric thickness: 100 m ~350 m Copper CCL thickness: 0.6 mm / 1.0mm / 1.6mm /2.0mm /3.0mm Copper foil: 1oz / 2 oz /3 oz Supply size : 500×600mm/400... [Read More]

2015-08-18 16:22:10

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